In 2014 the company announced UltraCMOS Global 1, a specialized wireless chip that combines different radio frequency functions on a single microchip and claims to let a single phone connect to more than 40 frequency bands. The company also claims that the power amplifier embedded on the Global 1 chip provides the same level of performance as the competing technology, gallium arsenide (GaAS). Global 1 will not be in volume production until late 2015 and will compete with Qualcomm's RF360 chip.
