  Silicon quantum photonics provides a promising pathway to realize large-scale
quantum photonic integrated circuits (QPICs) by exploiting the power of
complementary-metal-oxide-semiconductor (CMOS) technology. Toward scalable
operation of such silicon-based QPICs, a straightforward approach is to
integrate deterministic single-photon sources (SPSs). To this end, hybrid
integration of deterministic solid-state SPSs, such as those based on InAs/GaAs
quantum dots (QDs), is highly promising. However, the spectral and spatial
randomness inherent in the QDs pose a serious challenge for scalable
implementation of multiple identical SPSs on a silicon CMOS chip. To overcome
this challenge, we have been investigating a new hybrid integration technique
called transfer printing, which is based on a pick-and-place operation and
allows for the integration of desired QD SPSs on any locations on the silicon
CMOS chips at will. Nevertheless, even in this scenario, in-situ fine tuning
for perfect wavelength matching among the integrated QD SPSs will be required
for interfering photons from the dissimilar sources. Here, we demonstrate
in-situ wavelength tuning of QD SPSs integrated on a CMOS silicon chip. To
thermally tune the emission wavelengths of the integrated QDs, we augmented the
QD SPSs with optically driven heating pads. The integration of all the
necessary elements was performed using transfer printing, which largely
simplified the fabrication of the three-dimensional stack of micro/nanophotonic
structures. We further demonstrate in-situ wavelength matching between two
dissimilar QD sources integrated on the same silicon chip. Our
transfer-printing-based approach will open the possibility for realizing
large-scale QPICs that leverage CMOS technology.
