  Industry is moving towards large-scale systems where processor cores,
memories, accelerators, etc.\ are bundled via 2.5D integration. These various
components are fabricated separately as chiplets and then integrated using an
interconnect carrier, a so-called interposer. This new design style provides
benefits in terms of yield as well as economies of scale, as chiplets may come
from various third-party vendors, and be integrated into one sophisticated
system. The benefits of this approach, however, come at the cost of new
challenges for the system's security and integrity when many third-party
component chiplets, some from not fully trusted vendors, are integrated.
  Here, we explore these challenges, but also promises, for modern
interposer-based systems of cache-coherent, multi-core chiplets. First, we
introduce a new, coherence-based attack, GETXspy, wherein a single compromised
chiplet can expose a high-bandwidth side/covert-channel in an ostensibly secure
system. We further show that prior art is insufficient to stop this new attack.
Second, we propose using an active interposer as generic,
secure-by-construction platform that forms a physical root of trust for modern
2.5D systems. Our scheme has limited overhead, restricted to the active
interposer, allowing the chiplets and the coherence system to remain untouched.
We show that our scheme prevents a wide range of attacks, including but not
limited to our GETXspy attack, with little overhead on system performance,
$\sim$4\%. This overhead reduces as workloads increase, ensuring scalability of
the scheme.
