  Self-healing of polymer films often takes place as the molecules diffuse
across a damaged region, above their melting temperature. Using molecular
dynamics simulations we probe the healing of polymer films and compare the
results with those for thermal welding of homopolymer slabs. The two processes
differ in their interfacial structure since damage leads to increased
polydispersity and more short chains. A polymer sample was cut into two
separate films that were then held together in the melt state. The recovery of
the damaged film was followed as time elapsed and polymer molecules diffused
across the interface. The mass uptake and formation of entanglements, as
obtained from primitive path analysis, are extracted and correlated with the
interfacial strength obtained from shear simulations. We find that the
interdiffusion is significantly faster in the damaged film compared to welding
because of the presence of short chains. Though interfacial entanglements
increase more rapidly for the damaged films, a large fraction of them are near
chain ends. As a result, the interfacial strength of the healing film increases
more slowly than for welding. For both healing and welding, the interfacial
strength saturates as the bulk entanglement density is recovered across the
interface. However, the saturation strength of the damaged film is below the
bulk strength for the polymer sample. At saturation, cut chains remain near the
healing interface. They are less entangled and thus mechanically weaken the
interface. When the interfacial strength saturates, the number of interfacial
entanglements scales with the corresponding bulk entanglement density. Chain
stiffness increases the density of entanglements, which increases the
interfacial strength. Our results show that a few entanglements across the
interface are sufficient to resist interfacial chain pullout and enhance the
mechanical strength.
