  We expect that many-core microprocessors will push performance per chip from
the 10 gigaflop to the 10 teraflop range in the coming decade. To support this
increased performance, memory and inter-core bandwidths will also have to scale
by orders of magnitude. Pin limitations, the energy cost of electrical
signaling, and the non-scalability of chip-length global wires are significant
bandwidth impediments. Recent developments in silicon nanophotonic technology
have the potential to meet these off- and on- stack bandwidth requirements at
acceptable power levels.
  Corona is a 3D many-core architecture that uses nanophotonic communication
for both inter-core communication and off-stack communication to memory or I/O
devices. Its peak floating-point performance is 10 teraflops. Dense wavelength
division multiplexed optically connected memory modules provide 10 terabyte per
second memory bandwidth. A photonic crossbar fully interconnects its 256
low-power multithreaded cores at 20 terabyte per second bandwidth. We have
simulated a 1024 thread Corona system running synthetic benchmarks and scaled
versions of the SPLASH-2 benchmark suite. We believe that in comparison with an
electrically-connected many-core alternative that uses the same on-stack
interconnect power, Corona can provide 2 to 6 times more performance on many
memory-intensive workloads, while simultaneously reducing power.
