  Multi-die FPGAs are crucial components in modern computing systems,
particularly for high-performance applications such as artificial intelligence
and data centers. Super long lines (SLLs) provide interconnections between
super logic regions (SLRs) for a multi-die FPGA on a silicon interposer. They
have significantly higher delay compared to regular interconnects, which need
to be minimized. With the increase in design complexity, the growth of SLLs
gives rise to challenges in timing and power closure. Existing placement
algorithms focus on optimizing the number of SLLs but often face limitations
due to specific topologies of SLRs. Furthermore, they fall short of achieving
continuous optimization of SLLs throughout the entire placement process. This
highlights the necessity for more advanced and adaptable solutions.
  In this paper, we propose LEAPS, a comprehensive, systematic, and adaptable
multi-die FPGA placement algorithm for SLL minimization. Our contributions are
threefold: 1) proposing a high-performance global placement algorithm for
multi-die FPGAs that optimizes the number of SLLs while addressing other
essential design constraints such as wirelength, routability, and clock
routing; 2) introducing a versatile method for more complex SLR topologies of
multi-die FPGAs, surpassing the limitations of existing approaches; and 3)
executing continuous optimization of SLLs across the whole placement stages,
including global placement (GP), legalization (LG), and detailed placement
(DP). Experimental results demonstrate the effectiveness of LEAPS in reducing
SLLs and enhancing circuit performance. Compared with the most recent
state-of-the-art (SOTA) method, LEAPS achieves an average reduction of 40.19%
in SLLs and 9.99% in HPWL, while exhibiting a notable 34.34$\times$ improvement
in runtime.
