  Environmental sustainability, driven by concerns about climate change,
resource depletion, and pollution at local and global levels, poses an
existential threat to Integrated Circuits (ICs) throughout their entire life
cycle, particularly in manufacturing and usage. At the same time, with the
slowing down of Moore's Law, ICs with advanced 3D and 2.5D integration
technologies have emerged as promising and scalable solutions to meet the
growing computational power demands. However, there is a distinct lack of
carbon modeling tools specific to 3D and 2.5D ICs that can provide early-stage
insights into their carbon footprint to enable sustainability-driven design
space exploration. To address this, we propose 3D-Carbon, a first-of-its-kind
analytical carbon modeling tool designed to quantify the carbon emissions of
commercial-grade 3D and 2.5D ICs across their life cycle. With 3D-Carbon, we
can predict the embodied carbon emissions associated with manufacturing without
requiring precise knowledge of manufacturing parameters and estimate the
operational carbon emissions owing to energy consumption during usage through
surveyed parameters or third-party energy estimation plug-ins. Through several
case studies, we demonstrate the valuable insights and broad applicability of
3D-Carbon. We believe that 3D-Carbon lays the initial foundation for future
innovations in developing environmentally sustainable 3D and 2.5D ICs. The code
and collected parameters for 3D-Carbon are available at
https://anonymous.4open.science/r/3D-Carbon-9D5B/.
