  Modern real-time systems utilize considerable amounts of power while
executing computation-intensive tasks. The execution of these tasks leads to
significant power dissipation and heating of the device. It therefore results
in severe thermal issues like temperature escalation, high thermal gradients,
and excessive hot spot formation, which may result in degrading chip
performance, accelerating device aging, and premature failure. Thermal-Aware
Scheduling (TAS) enables the optimization of thermal dissipation to maintain a
safe thermal state. In this work, we implement a new TAS algorithm, POD-TAS,
which manages the thermal behavior of the cores based on a defined set of
states and their transitions. We compare the performances of a dynamic
Resistor-Capacitor (RC) thermal circuit simulator (HotSpot) and a reduced order
Proper Orthogonal Decomposition (POD)-based thermal model and we select the
latter for use in our POD-TAS algorithm. We implement a novel simulation-based
evaluation methodology to compare TAS algorithms. This methodology is used to
evaluate the performance of the proposed POD-TAS algorithm with high
spatiotemporal resolution. Additionally, we compare the performance of a state
of the art TAS algorithm, RT-TAS, to our proposed POD-TAS algorithm.
Furthermore, we utilize the Clarkson Open-source Multi-physics Benchmark Suite
(COMBS) to provide CPU workloads for task scheduling. Our experimental results
on a multi-core processor using a set of 4 benchmarks demonstrate that the
proposed POD-TAS method can improve thermal performance by decreasing the peak
thermal variance by 53.0% and the peak chip temperature by 29.01%. Using a set
of 8 benchmarks, the comparison of the algorithms demonstrates that POD-TAS
decreases the peak spatial variance of the chip temperature and the peak chip
temperature by 29.57% and 26.26% respectively.
