  Digital Image Correlation (DIC) is of vital importance in the field of
experimental mechanics, yet, producing suitable DIC patterns for demanding
in-situ mechanical tests remains challenging, especially for ultra-fine
patterns, despite the large number of patterning techniques in the literature.
Therefore, we propose a simple, flexible, one-step technique (only requiring a
conventional deposition machine) to obtain scalable, high-quality, robust DIC
patterns, suitable for a range of microscopic techniques, by deposition of a
low melting temperature solder alloy in so-called 'island growth' mode, without
elevating the substrate temperature. Proof of principle is shown by
(near-)room-temperature deposition of InSn patterns, yielding highly dense,
homogeneous DIC patterns over large areas with a feature size that can be tuned
from as small as 10nm to 2um and with control over the feature shape and
density by changing the deposition parameters. Pattern optimization, in terms
of feature size, density, and contrast, is demonstrated for imaging with atomic
force microscopy, scanning electron microscopy (SEM), optical microscopy and
profilometry. Moreover, the performance of the InSn DIC patterns and their
robustness to large deformations is validated in two challenging case studies
of in-situ micro-mechanical testing: (i) self-adaptive isogeometric digital
height correlation of optical surface height profiles of a coarse, bimodal InSn
pattern providing microscopic 3D deformation fields (illustrated for
delamination of aluminum interconnects on a polyimide substrate) and (ii) DIC
on SEM images of a much finer InSn pattern allowing quantification of high
strains near fracture locations (illustrated for rupture of a Fe foil). As
such, the high controllability, performance and scalability of the DIC patterns
offers a promising step towards more routine DIC-based in-situ micro-mechanical
testing.
