  Sharp nanoscale tips on metal surfaces of electrodes enhance locally applied
electric fields. Strongly enhanced electric fields trigger electron field
emission and atom evaporation from the apexes of the nanotips. Combined
together, these processes may explain electric discharges in form of small
local arcs observed near metal surfaces in the presence of electric fields even
in ultra high vacuum conditions. In the present work we investigate the
stability of nanoscale tips by means of computer simulations of surface
diffusion processes on copper (Cu), the main material of high voltage
electronics. We study the stability and life-time of thin Cu surface nanotips
at different temperatures in terms of diffusion processes. For this purpose, we
have developed a surface Kinetic Monte Carlo (KMC) model where the jump
processes are described by tabulated precalculated energy barriers. We show
that tall surface features with high aspect ratios can be fairly stable at room
temperature. However, the stability was found to depend strongly on the
temperature: 13 nm nanotips with the major axes in the <110> crystallographic
directions were found to flatten down to half of the original height in less
than 100 ns at temperatures close to the melting point, whereas no significant
change in the height of these nanotips was observed after 10 $\mu$s at room
temperature. Moreover, the nanotips built up along the <110> crystallographic
directions were found significantly more stable than those oriented in the
<100> or <111> crystallographic directions. The proposed KMC model has been
found well suited for simulating atomic surfaces processes and was validated
against Molecular Dynamics (MD) simulation results via the comparison of the
flattening times obtained by both methods. We also note that the KMC
simulations were two orders of magnitude computationally faster than the
corresponding MD calculations.
