  Response time requirements for big data processing systems are shrinking. To
meet this strict response time requirement, many big data systems store all or
most of their data in main memory to reduce the access latency. Main memory
capacities have grown, and systems with 2 TB of main memory capacity available
today. However, the rate at which processors can access this data--the memory
bandwidth--has not grown at the same rate. In fact, some of these big-memory
systems can access less than 10% of their main memory capacity in one second
(billions of processor cycles).
  3D die-stacking is one promising solution to this bandwidth problem, and
industry is investing significantly in 3D die-stacking. We use a simple
back-of-the-envelope-style model to characterize if and when the 3D die-stacked
architecture is more cost-effective than current architectures for in-memory
big data workloads. We find that die-stacking has much higher performance than
current systems (up to 256x lower response times), and it does not require
expensive memory over provisioning to meet real-time (10 ms) response time
service-level agreements. However, the power requirements of the die-stacked
systems are significantly higher (up to 50x) than current systems, and its
memory capacity is lower in many cases. Even in this limited case study, we
find 3D die-stacking is not a panacea. Today, die-stacking is the most
cost-effective solution for strict SLAs and by reducing the power of the
compute chip and increasing memory densities die-stacking can be cost-effective
under other constraints in the future.
