  Heterogeneous 3D System-on-Chips (3D SoCs) are the most promising design
paradigm to combine sensing and computing within a single chip. A special
characteristic of communication networks in heterogeneous 3D SoCs is the
varying latency and throughput in each layer. As shown in this work, this
variance drastically degrades the network performance. We contribute a
co-design of routing algorithms and router microarchitecture that allows to
overcome these performance limitations. We analyze the challenges of
heterogeneity: Technology-aware models are proposed for communication and
thereby identify layers in which packets are transmitted slower. The
communication models are precise for latency and throughput under zero load.
The technology model has an area error and a timing error of less than 7.4% for
various commercial technologies from 90 to 28nm. Second, we demonstrate how to
overcome limitations of heterogeneity by proposing two novel routing algorithms
called Z+(XY)Z- and ZXYZ that enhance latency by up to 6.5x compared to
conventional dimension order routing. Furthermore, we propose a high
vertical-throughput router microarchitecture that is adjusted to the routing
algorithms and that fully overcomes the limitations of slower layers. We
achieve an increased throughput of 2 to 4x compared to a conventional router.
Thereby, the dynamic power of routers is reduced by up to 41.1% and we achieve
improved flit latency of up to 2.26x at small total router area costs between
2.1% and 10.4% for realistic technologies and application scenarios.
