  In recent years, the growing demand to process large graphs and sparse
datasets has led to increased research efforts to develop hardware- and
software-based architectural solutions to accelerate them. While some of these
approaches achieve scalable parallelization with up to thousands of cores,
adaptation of these proposals by the industry remained slow. To help solve this
dissonance, we identified a set of questions and considerations that current
research has not considered deeply. Starting from a tile-based architecture, we
put forward a Distributed Chiplet-based Reconfigurable Architecture (DCRA) for
irregular applications that carefully consider fabrication constraints that
made prior work either hard or costly to implement or too rigid to be applied.
We identify and study pre-silicon, package-time and compile-time configurations
that help optimize DCRA for different deployments and target metrics. To enable
that, we propose a practical path for manufacturing chip packages by composing
variable numbers of DCRA and memory dies, with a software-configurable Torus
network to connect them. We evaluate six applications and four datasets, with
several configurations and memory technologies, to provide a detailed analysis
of the performance, power, and cost of DCRA as a compute node for scale-out
sparse data processing. Finally, we present our findings and discuss how DCRA,
together with our framework for design exploration, can help guide architects
to build scalable and cost-efficient systems for irregular applications.
