  Decades of progress in energy-efficient and low-power design have
successfully reduced the operational carbon footprint in the semiconductor
industry. However, this has led to an increase in embodied emissions,
encompassing carbon emissions arising from design, manufacturing, packaging,
and other infrastructural activities. While existing research has developed
tools to analyze embodied carbon at the computer architecture level for
traditional monolithic systems, these tools do not apply to near-mainstream
heterogeneous integration (HI) technologies. HI systems offer significant
potential for sustainable computing by minimizing carbon emissions through two
key strategies: ``reducing" computation by reusing pre-designed chiplet IP
blocks and adopting hierarchical approaches to system design. The reuse of
chiplets across multiple designs, even spanning multiple generations of
integrated circuits (ICs), can substantially reduce embodied carbon emissions
throughout the operational lifespan. This paper introduces a carbon analysis
tool specifically designed to assess the potential of HI systems in
facilitating greener VLSI system design and manufacturing approaches. The tool
takes into account scaling, chiplet and packaging yields, design complexity,
and even carbon overheads associated with advanced packaging techniques
employed in heterogeneous systems. Experimental results demonstrate that HI can
achieve a reduction of embodied carbon emissions up to 70\% compared to
traditional large monolithic systems. These findings suggest that HI can pave
the way for sustainable computing practices, contributing to a more
environmentally conscious semiconductor industry.
