  In-memory computing (IMC) on a monolithic chip for deep learning faces
dramatic challenges on area, yield, and on-chip interconnection cost due to the
ever-increasing model sizes. 2.5D integration or chiplet-based architectures
interconnect multiple small chips (i.e., chiplets) to form a large computing
system, presenting a feasible solution beyond a monolithic IMC architecture to
accelerate large deep learning models. This paper presents a new benchmarking
simulator, SIAM, to evaluate the performance of chiplet-based IMC architectures
and explore the potential of such a paradigm shift in IMC architecture design.
SIAM integrates device, circuit, architecture, network-on-chip (NoC),
network-on-package (NoP), and DRAM access models to realize an end-to-end
system. SIAM is scalable in its support of a wide range of deep neural networks
(DNNs), customizable to various network structures and configurations, and
capable of efficient design space exploration. We demonstrate the flexibility,
scalability, and simulation speed of SIAM by benchmarking different
state-of-the-art DNNs with CIFAR-10, CIFAR-100, and ImageNet datasets. We
further calibrate the simulation results with a published silicon result,
SIMBA. The chiplet-based IMC architecture obtained through SIAM shows
130$\times$ and 72$\times$ improvement in energy-efficiency for ResNet-50 on
the ImageNet dataset compared to Nvidia V100 and T4 GPUs.
