  The electrical resistivity and the anisotropic magnetoresistance (AMR) was
investigated for Ni Co alloys at and below room temperature. The Ni Co alloy
layers having a thickness of about 2 um were prepared by electrodeposition on
Si wafers with evaporated Cr and Cu underlayers. The alloy composition was
varied in the whole concentration range by varying the ratio of Ni sulfate and
Co sulfate in the electrolyte. The Ni Co alloy deposits were investigated first
in the as deposited state on the substrates and then, by mechanically stripping
them from the substrates, as self supporting layers both without and after
annealing. According to an X ray diffraction study, a strongly textured face
centered cubic (fcc) structure was formed in the as deposited state with an
average grain size of about 10 nm. Upon annealing, the crystal structure was
retained whereas the grain size increased by a factor of 3 to 5, depending on
alloy composition. The zero field resistivity decreased strongly by annealing
due to the increased grain size. The annealing hardly changed the AMR below 50
at.% Co but strongly decreased it above this concentration. The composition
dependence of the resistivity and the AMR of the annealed Ni Co alloy deposits
was in good quantitative agreement with the available literature data both at
13 K and at room temperature. Both transport parameters were found to exhibit a
pronounced maximum in the composition range between 20 and 30 at.% Co and the
data of the Ni Co alloys fit well to the limiting values of the pure component
metals (fcc Ni and fcc Co). The only theoretical calculation reported formerly
on fcc Ni Co alloys yielded at T=0K a resistivity value smaller by a factor of
5 and an AMR value larger by a factor of about 2 than the corresponding low
temperature experimental data, although the theoretical results properly
reproduced the composition dependence of both quantities.
