  Today, continued miniaturization in electronic integrated circuits (ICs)
appears to have reached its fundamental limit. At the same time, energy
consumption due by communication becomes the dominant limitation in high
performance electronic ICs for computing, and modern computing concepts such a
neural networks further amplify the challenge. Photonic communication is a
promising strategy to address the second, while adding a third dimension to the
predominantly two dimensional integrated circuits appears the most promising
future strategy for further IC architecture improvement. Crucial for efficient
electronic-photonic co-integration is CMOS compatibility. Here, we review our
latest results obtained in the FEMTO-ST RENATECH facilities on using additive
photo-induced polymerization of a standard photo-resin for truly 3D photonic
integration according to these principles. Based on one- and two-photon
polymerization and combined with direct-laser writing, we 3D-printed air- and
polymer-cladded photonic waveguides. An important application of such circuits
are the interconnects of optical neural networks, where 3D integration enables
scalability in terms of network size versus its geometric dimensions. In
particular via \emph{flash}-TPP, a fabrication process combining blanket one-
and high-resolution two-photon polymerization, we demonstrated polymer-cladded
step-index waveguides with up to 6~mm length, low insertion ($\sim$0.26~dB) and
propagation ($\sim$1.3~dB/mm) losses, realized broadband and low loss
($\sim$0.06~dB splitting losses) adiabatic 1 to M couplers as well as tightly
confining air-cladded waveguides for denser integration. By stably printing
such integrated photonic circuits on standard semiconductor samples, we show
the concept's CMOS compatibility. With this, we lay out a promising, future
avenue for scalable integration of hybrid photonic and electronic components.
