  Heterogeneous manycore architectures are the key to efficiently execute
compute- and data-intensive applications. Through silicon via (TSV)-based 3D
manycore system is a promising solution in this direction as it enables
integration of disparate computing cores on a single system. However, the
achievable performance of conventional through-silicon-via (TSV)-based 3D
systems is ultimately bottlenecked by the horizontal wires (wires in each
planar die). Moreover, current TSV 3D architectures suffer from thermal
limitations. Hence, TSV-based architectures do not realize the full potential
of 3D integration. Monolithic 3D (M3D) integration, a breakthrough technology
to achieve - More Moore and More Than Moore - and opens up the possibility of
designing cores and associated network routers using multiple layers by
utilizing monolithic inter-tier vias (MIVs) and hence, reducing the effective
wire length. Compared to TSV-based 3D ICs, M3D offers the true benefits of
vertical dimension for system integration: the size of a MIV used in M3D is
over 100x smaller than a TSV. In this work, we demonstrate how M3D-enabled
vertical core and uncore elements offer significant performance and thermal
improvements in manycore heterogeneous architectures compared to its TSV-based
counterpart. To overcome the difficult optimization challenges due to the large
design space and complex interactions among the heterogeneous components (CPU,
GPU, Last Level Cache, etc.) in an M3D-based manycore chip, we leverage novel
design-space exploration algorithms to trade-off different objectives. The
proposed M3D-enabled heterogeneous architecture, called HeM3D, outperforms its
state-of-the-art TSV-equivalent counterpart by up to 18.3% in execution time
while being up to 19 degrees Celcius cooler.
