  The simulation of heat flow through heterogeneous material is important for
the design of structural and electronic components. Classical analytical
solutions to the heat equation PDE are not known for many such domains, even
those having simple geometries. The finite element method can provide
approximations to a weak form continuum solution, with increasing accuracy as
the number of degrees of freedom in the model increases. This comes at a cost
of increased memory usage and computation time; even when taking advantage of
sparse matrix techniques for the finite element system matrix. We summarize
recent approaches in solving problems in structural mechanics and steady state
heat conduction which do not require the explicit assembly of any system
matrices, and adapt them to a method for solving the time-depended flow of
heat. These approaches are highly parallelizable, and can be performed on
graphical processing units (GPUs). Furthermore, they lend themselves to the
simulation of heterogeneous material, with a minimum of added complexity. We
present the mathematical framework of assembly-free FEM approaches, through
which we summarize the benefits of GPU computation. We discuss our
implementation using the OpenCL computing framework, and show how it is further
adapted for use on multiple GPUs. We compare the performance of single and dual
GPUs implementations of our method with previous GPU computing strategies from
the literature and a CPU sparse matrix approach. The utility of the novel
method is demonstrated through the solution of a real-world coefficient inverse
problem that requires thousands of transient heat flow simulations, each of
which involves solving a 1 million degree of freedom linear system over
hundreds of time steps.
