  Before reflow soldering of integrated electronic products, the numerical
simulation of temperature control curve of reflow furnace is crucial for
selecting proper parameters and improving the overall efficiency of reflow
soldering process and product quality. According to the heat conduction law and
the specific heat capacity formula, the first-order ordinary differential
equation of the central temperature curve of the welding area with respect to
the temperature distribution function in the furnace on the conveyor belt
displacement is obtained. For the gap with small temperature difference, the
sigmoid function is used to obtain a smooth interval temperature transition
curve; For the gap with large temperature difference, the linear combination of
exponential function and primary function is used to approach the actual
concave function, so as to obtain the complete temperature distribution
function in the furnace. The welding parameters are obtained by solving the
ordinary differential equation, and a set of optimal process parameters
consistent with the process boundary are obtained by calculating the mean
square error between the predicted temperature field and the real temperature
distribution. At the same time, a set of reflow optimization strategies are
designed for speed interval prediction strategy, minimum parameter interval
prediction strategy, and the most symmetrical parameter interval prediction of
solder paste melting reflow area. The simulation results show that the
temperature field prediction results obtained by this method are highly
consistent with the actual sensor data, and have strong correlation. This
method can help to select appropriate process parameters, optimize the
production process, reduce equipment commissioning practice and optimize the
solder joint quality of production products.
