  We present CLEAR (Cross-Layer Exploration for Architecting Resilience), a
first of its kind framework which overcomes a major challenge in the design of
digital systems that are resilient to reliability failures: achieve desired
resilience targets at minimal costs (energy, power, execution time, area) by
combining resilience techniques across various layers of the system stack
(circuit, logic, architecture, software, algorithm). This is also referred to
as cross-layer resilience. In this paper, we focus on radiation-induced soft
errors in processor cores. We address both single-event upsets (SEUs) and
single-event multiple upsets (SEMUs) in terrestrial environments. Our framework
automatically and systematically explores the large space of comprehensive
resilience techniques and their combinations across various layers of the
system stack (586 cross-layer combinations in this paper), derives
cost-effective solutions that achieve resilience targets at minimal costs, and
provides guidelines for the design of new resilience techniques. Our results
demonstrate that a carefully optimized combination of circuit-level hardening,
logic-level parity checking, and micro-architectural recovery provides a highly
cost-effective soft error resilience solution for general-purpose processor
cores. For example, a 50x improvement in silent data corruption rate is
achieved at only 2.1% energy cost for an out-of-order core (6.1% for an
in-order core) with no speed impact. However, (application-aware) selective
circuit-level hardening alone, guided by a thorough analysis of the effects of
soft errors on application benchmarks, provides a cost-effective soft error
resilience solution as well (with ~1% additional energy cost for a 50x
improvement in silent data corruption rate).
