  Dense and efficient circuits with component sizes approaching the physical
limit is the hallmark of high performance integration. However, current
fabrication technology is mostly constraint to 2D lithography, and thermal
energy dissipation induced by switching electronic signal lines presents a
fundamental challenge for truly 3D electronic integration. Photonics reduces
this problem, and direct laser writing of a photoresin is a promising
high-resolution tool for 3D photonic integration. Here, we combine one and
two-photon polymerization (TPP) for waveguide integration for the first time,
dramatically accelerating the fabrication process and increasing optical
confinement. 3D additive printing is based on femtosecond TPP, while blanket
irradiation with a UV lamp induces one-photon polymerization (OPP) throughout
the entire 3D chip. We locally and dynamically adjust writing conditions to
implement (3+1)D \emph{flash}-TPP: waveguide cores are printed with a small
distance between neighboring writing voxels to ensure smooth interfaces,
mechanical support structures are printed at maximal distance between the
voxels to speed up the process. Finally, the entire chip's \emph{passive}
volume not part of waveguide cores or mechanical support is polymerized in a
single instance by UV blanket irradiation. This decouples fabrication time from
the passive volume's size. We succeed in printing vertical single-mode
waveguides of 6~mm length that reach up to NA = 0.16. Noteworthy, we achieve
exceptionally low -0.26 dB injection and very low propagation losses of -1.36
dB/mm, which is within one order of magnitude of standard integrated silicon
photonics. Finally, the optical performance of our waveguides does not
deteriorate during 120 days within our measurement uncertainty.
