  Processing cores and the accompanying main memory working in tandem enable
the modern processors. Dissipating heat produced from computation, memory
access remains a significant problem for processors. Therefore, processor
thermal management continues to be an active research topic. Most thermal
management research takes place using simulations, given the challenges of
measuring temperature in real processors. Since core and memory are fabricated
on separate packages in most existing processors, with the memory having lower
power densities, thermal management research in processors has primarily
focused on the cores.
  Memory bandwidth limitations associated with 2D processors lead to
high-density 2.5D and 3D packaging technology. 2.5D packaging places cores and
memory on the same package. 3D packaging technology takes it further by
stacking layers of memory on the top of cores themselves. Such packagings
significantly increase the power density, making processors prone to heating.
Therefore, mitigating thermal issues in high-density processors (packaged with
stacked memory) becomes an even more pressing problem. However, given the lack
of thermal modeling for memories in existing interval thermal simulation
toolchains, they are unsuitable for studying thermal management for
high-density processors.
  To address this issue, we present CoMeT, the first integrated Core and Memory
interval Thermal simulation toolchain. CoMeT comprehensively supports thermal
simulation of high- and low-density processors corresponding to four different
core-memory configurations - off-chip DDR memory, off-chip 3D memory, 2.5D, and
3D. CoMeT supports several novel features that facilitate overlying system
research. Compared to an equivalent state-of-the-art core-only toolchain, CoMeT
adds only a ~5% simulation-time overhead. The source code of CoMeT has been
made open for public use under the MIT license.
