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Manufacturing

LED manufacturing involves multiple steps, including epitaxy, chip processing, chip separation, and packaging.

In a typical LED manufacturing process, encapsulation is performed after probing, dicing, die transfer from wafer to package, and wire bonding or flip chip mounting, perhaps using indium tin oxide, a transparent electrical conductor. In this case, the bond wire(s) are attached to the ITO film that has been deposited in the LEDs.

Flip chip circuit on board (COB) is a technique that can be used to manufacture LEDs.