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Solder

Tin has long been used in alloys with lead as solder, in amounts of 5 to 70% w/w. Tin with lead forms a eutectic mixture at the weight proportion of 61.9% tin and 38.1% lead (the atomic proportion: 73.9% tin and 26.1% lead), with melting temperature of 183 °C (361.4 °F). Such solders are primarily used for joining pipes or electric circuits. Since the European Union Waste Electrical and Electronic Equipment Directive (WEEE Directive) and Restriction of Hazardous Substances Directive came into effect on 1 July 2006, the lead content in such alloys has decreased. While lead exposure is associated with serious health problems, lead-free solder is not without its challenges, including a higher melting point, and the formation of tin whiskers that cause electrical problems. Tin pest can occur in lead-free solders, leading to loss of the soldered joint. Replacement alloys are being found, but the problems of joint integrity remain. A common lead-free alloy is 99% tin, 0.7% copper, and 0.3% silver, with melting temperature of 217 °C (422.6 °F).