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Frank Pompeo - found 14 in the US

age: ~57 Full Profile

Known as: Frank Pompeo, Frank Dipompeo, Frank Di ...

Related to: John Lorenz, 67Pompeo Di, 86Pompeo Di, 54Frank Dipompeo ...

Has lived in: La Grange Highlands, ILBerwyn, ILCicero, IL

age: ~67 Full Profile

Known as: Frank Pompeo, Franka Pompeo

Related to: Michael Mccallum, 42Michele Mccallum, 40Denise Pompeo, 60 ...

Has lived in: Port Saint Lucie, FLAttleboro, MATampa, FL ...

age: ~92 Full Profile

Known as: Frank Pompeo

Related to: Donna Kenney, 55Donna Pompeo, 92Judy Pompeo, 65 ...

Has lived in: Phoenix, AZ

age: ~56 Full Profile

Known as: Frank Pompeo

Related to: Anne PomperLisa Pompeo, 53Karen Guidone, 78Louis Guidone, 84 ...

Has lived in: Redding, CTWallkill, NYWalden, NY ...

age: ~37 Full Profile

Known as: Frank A Pompeo, Jr F Pompeo ...

Related to: Mark Daniels, 43Stan Daniels, 80Stanley Daniels

Has lived in: Escondido, CAValley Center, CASan Diego, CA

age: ~73 Full Profile

Related to: Mark Daniels, 43Stan Daniels, 80Stanley Daniels

Has lived in: Valley Center, CA

age: ~57 Full Profile

Related to: Suzanne Lewis, 70Lorri Zimmerman, 52Lorri Zimmerman, 57 ...

Has lived in: East Stroudsburg, PAPort Charlotte, FL

age: ~64 Full Profile

Has lived in: Pembroke Pines, FL

age: n/a Full Profile

Related to: Patricia PompeoTerry Pompeo, 59Amelia Pompeo, 180 ...

Has lived in: Cimarron, NM

age: n/a Full Profile

Related to: Violet Pompeo, 86

Has lived in: Bradenton, FLWoodside, NY

Mentions about a name: Frank Pompeo

Frank Pompeo search results US Map
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Public records

Frank Louis Pompeo age ~56

Lived in: Redding, CT, Nelson, NE, Wallkill, NY, Walden, NY, Newburgh, NY, Montgomery, NY, Hopewell Junction, NY, Middletown, NY, Elizaville, NY, Armonk, NY

Related to: Anne Bardsley, Lisa Pompeo, Margaret Moloughney, James Hooghuis

Work: IBM Corporation

Frank Di Pompeo age ~57

Lived in: La Grange, IL, Western Springs, IL, Berwyn, IL, Cicero, IL, Indian Head Park, IL

Related to: P Dipompeo, Chris Pompeo, Mary Dipompeo, Ryan Dipompeo, Len Dipompeo, Jacob Dipompeo

Work: St. John of The Cross Parish

Frank Anthony Pompeo age ~67

Lived in: Franklin, PA, Port Saint Lucie, FL, Oil City, PA, Attleboro, MA, Boca Raton, FL, Tampa, FL, Hollywood, FL, Escondido, CA, Reno, PA, Fort Lauderdale, FL, Pompano Beach, FL, Middle Village, NY

Related to: Denise Pompeo, Rowene Pompeo, Ralph Pompeo, Michele McCallum, Pamela Cronkhite, Carmela Pompeo, Melinda Pompeo, Joseph Pompeo, Stacey Pompeo

Frank Paul Pompeo age ~58

Lived in: East Stroudsburg, PA, Pocono Summit, PA, Scotrun, PA, Bartonsville, PA, Port Charlotte, FL, Swiftwater, PA

Related to: Lorri Pompeo, Melissa Klein, Suzanne Pompeo, Guido Pompeo, Connie Geiger

Frank A Pompeo age ~37

Lived in: Escondido, CA, Valley Center, CA

Related to: Jr Pompeo, Joanne Pompeo

Frank A Pompeo

Lived in: Cimarron, NM, Flagstaff, AZ, Raton, NM

Related to: Terry Pompeo, Maya Pompeo, Gene Pompeo, Margaret Pompeo, Michael Pompeo, Amelia Pompeo, Angelo Pompeo, Patricia Zamora

Frank Pompeo

Lived in: Attleboro, MA, Port Saint Lucie, FL, Allston, MA

Related to: Denise Pompeo, Melinda Pompeo

Frank Di Pompeo age ~60

Lived in: Philadelphia, PA

Related to: Maryann Dipompeo, Nicholas Dipompeo, Shannon Dipompeo-gulak, MaryElizabeth Dipompeo

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Resumes

Resumes

Frank Pompeo - Palm Desert, CA

Work

Company: Dj service     2007 to 2000
Self employed

Company: Monster beverage co - San Diego, CA     2007 to 2010
Promotions manager, (greater san diego market)

Company: Summer winter action tours - Southern California     2003 to 2007
Marketing / sales manager

Education

School: California State University San Marcos     May 2004
Bachelor of arts in communication

Skills

 Events, DJ, Marketing, Computers, Communication, Promotions, Spanish

Show details..

Phones & Addresses

NameAddressPhone
Frank Pompeo66 Lake Osiris, Walden, NY 12586(845) 778-2565
Frank A Pompeo1461 Rocky Grove Ave, Franklin, PA 16323(814) 437-5979, (814) 432-2315
Frank Pompeo21734 Arriba Real, Boca Raton, FL 33433(561) 477-9709
Frank L Pompeo5 Ulster Ter, Wallkill, NY 12589(845) 566-4134
Frank A Pompeo445 7Th, Cimarron, NM 87714(505) 376-2565, (575) 376-2565, (575) 376-2545
Frank Pompeo445 Rr 1, Cimarron, NM 87714(505) 376-2565
Frank Pompeo445 7Th St, Cimarron, NM 87714(505) 376-2565
Frank Pompeo908 Mill Pl, Montgomery, NY 12549(845) 457-4001
Frank Pompeo395 Brown, Attleboro, MA 02703(508) 639-9757
Frank Di PompeoPhiladelphia, PA(215) 342-9782
Frank Pompeo2415 Alden St, Port Saint Lucie, FL 34984(772) 879-2477
Frank Pompeo10151 5Th St, Hollywood, FL 33026(954) 432-1288
Frank Pompeo2202 Montemar Ave, Escondido, CA 92027(760) 745-1465
Frank Pompeo10151 5Th, Hollywood, FL 33026(954) 432-1288
Frank A Pompeo153 Washington, Cimarron, NM 87714(575) 376-2545
Frank Pompeo4423 Beck, Phoenix, AZ 85032(602) 992-7800, (602) 992-6552
Frank P Pompeo182 Buxton Ave Ne, Port Charlotte, FL 33952
Frank Pompeo1142 Preston Ln, Port Saint Lucie, FL 34983
Frank Pompeo610 Haven Pl, Escondido, CA 92027
Frank P Pompeo3985 Chipperfield Dr, East Stroudsburg, PA 18301
Frank Pompeo66 Lake Osiris Rd, Walden, NY 12586(845) 778-****
Frank Pompeo4988 N University Dr # 139, Lauderhill, FL 33351
Frank Pompeo, age ~914537 E Tierra Buena Ln, Phoenix, AZ 85032(602) 487-****
Frank Pompeo, age ~82445 E 7Th St, Cimarron, NM 87714(575) 376-****
Frank Pompeo250 S Orange St, Escondido, CA 92025

Organizations

Name / TitleCompany / ClassificationPhones & Addresses
Frank Pompeo
Chief Executive Officer, Treasurer
Keeley & Frank Mechanical Contractors, Inc
Plumbing Heating Air Conditioning & Bathroom Remodeling Contractor
1461 Rocky Grove Ave, Franklin, PA 16323
PO Box 688, Franklin, PA 16323
(814) 677-6500
Frank Pompeo
President, Treasurer, Director
Four M Card Shop, Inc4800 Nw 96Th Dr, Pompano Beach, FL 33076

Publications

US Patents

Method For Directly Joining A Chip To A Heat Sink

United States Patent InventorAppl. No.Assignee

#5533256Jul 9, 1996

Filed: Jun 5, 1995

Anson J. Call (Holmes, NY)
Stephen H. Meisner (Hudson, NY)
Frank L. Pompeo (Walden, NY)
Jeffrey A. Zitz (Poughkeepsie, NY)
8/461814 International Business Machines Corporation (Armonk, NY)
International Classification: H05K 334U.S. Classification: 29840

Abstract: The present invention relates generally to a new apparatus and method for directly joining a chip to a heat sink. More particularly, the invention encompasses an apparatus and a method that uses a double-sided, pressure-sensitive, thermally-conductive adhesive tape to directly join a chip or similar such device to a heat sink.

Enhanced Ceramic Ball Grid Array Using In-Situ Solder Stretch With Spring

United States Patent InventorAppl. No.Assignee

#5968670Oct 19, 1999

Filed: Aug 12, 1997

Peter J. Brofman (Hopewell Junction, NY)
Patrick A. Coico (Fishkill, NY)
Mark G. Courtney (Poughkeepsie, NY)
James H. Covell (Poughkeepsie, NY)
Shaji Farooq (Hopewell Junction, NY)
Lewis S. Goldmann (Bedford, NY)
Raymond A. Jackson (Poughkeepsie, NY)
David C. Linnell (Poughkeepsie, NY)
Gregory B. Martin (Wappingers Falls, NY)
Frank L. Pompeo (Montgomery, NY)
Kathleen A. Stalter (Hopewell Junction, NY)
Hilton T. Toy (Wappingers Falls, NY)
8/909864 International Business Machines Corporation (Armonk, NY)
International Classification: H01L 2160, B23K 3514U.S. Classification: 428576

Abstract: A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.

Ceramic Ball Grid Array Using In-Situ Solder Stretch

United States Patent InventorAppl. No.Assignee

#5975409Nov 2, 1999

Filed: Aug 12, 1997

Peter J. Brofman (Hopewell Junction, NY)
Patrick A. Coico (Fishkill, NY)
Mark G. Courtney (Poughkeepsie, NY)
Shaji Farooq (Hopewell Junction, NY)
Lewis S. Goldmann (Bedford, NY)
Raymond A. Jackson (Poughkeepsie, NY)
David C. Linnell (Poughkeepsie, NY)
Gregory B. Martin (Wappingers Falls, NY)
Frank L. Pompeo (Montgomery, NY)
Kathleen A. Stalter (Hopewell Junction, NY)
Hilton T. Toy (Wappingers Falls, NY)
8/909865 International Business Machines Corporation (Armonk, NY)
International Classification: B23K 3102, B23K 3704U.S. Classification: 22818022

Abstract: A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.

Cleavable Diepoxide For Removable Epoxy Compositions

United States Patent InventorAppl. No.Assignee

#5512613Apr 30, 1996

Filed: Mar 18, 1994

Stephen L. Buchwalter (Hopewell Junction, NY)
Jeffrey D. Gelorme (Plainville, CT)
Laura L. Kosbar (Mohegan Lake, NY)
Bert H. Newman (Carmel, NY)
Frank L. Pompeo (Walden, NY)
8/210879 International Business Machines Corporation (Armonk, NY)
International Classification: C08G 5900, C08G 6300U.S. Classification: 523443

Abstract: A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent and an amine promoter.

Temporary Attach Article And Method For Temporary Attach Of Devices To A Substrate

United States Patent InventorAppl. No.Assignee

#6303400Oct 16, 2001

Filed: Sep 23, 1999

Mario J. Interrante (New Paltz, NY)
Thomas E. Lombardi (Poughkeepsie, NY)
Frank L. Pompeo (Montgomery, NY)
William E. Sablinski (Beacon, NY)
9/404511 International Business Machines Corporation (Armonk, NY)
International Classification: G01R 3126U.S. Classification: 438 15

Abstract: A temporary attach article of a first component to a second component which includes a first component having a first volume of a fusible material; a second component having a second volume of fusible material; and the first and second components being joined together through the first and second volumes of fusible material, wherein the first volume of fusible material has a melting point higher than a melting point of the second volume of fusible material so that the first and second components may be joined together without melting of the first volume of fusible material and wherein the second volume of fusible material is 5 to 20% of the first volume of fusible material. Also disclosed is a method for temporary attach of devices to an electronic substrate.

Aryl Cyanate And/or Diepoxide And Tetrahydropyranyl-Protected Hydroxymethylated Phenolic Or Hydroxystyrene Resin

United States Patent InventorAppl. No.Assignee

#6114450Sep 5, 2000

Filed: May 4, 1999

Krishna Gandhi Sachdev (Hopewell Junction, NY)
Michael Berger (Gardiner, NY)
Anson Jay Call (Poughkeepsie, NY)
Frank Louis Pompeo Jr. (Walden, NY)
9/304610 International Business Corporation (Armonk, NY)
International Classification: C08K 308, C08L 6300, C08L 6302, C08L 7900U.S. Classification: 525118

Abstract: An adhesive for bonding a die of an integrated circuit chip comprises an aryl cyanate (ester) resin and/or a diepoxide resin admixed with tetrahydropyranyl-protected hydroxylmethylated phenolic resin or hydroxymethylated poly(hydroxystyrene) optionally further containing an electrically or thermally conductive filler.

Multi-Layer Solder Seal Band For Semiconductor Substrates

United States Patent InventorAppl. No.Assignee

#5881944Mar 16, 1999

Filed: Apr 30, 1997

David L. Edwards (Poughkeepsie, NY)
Armando S. Cammarano (Hyde Park, NY)
Jeffrey T. Coffin (Pleasant Valley, NY)
Mark G. Courtney (Poughkeepsie, NY)
Stephen S. Drofitz (Wappingers Falls, NY)
Michael J. Ellsworth (Poughkeepsie, NY)
Lewis S. Goldmann (Bedford, NY)
Sushumna Iruvanti (Wappingers Falls, NY)
Frank L. Pompeo (Montgomery, NY)
William E. Sablinski (Beacon, NY)
Raed A. Sherif (Croton, NY)
Hilton T. Toy (Wappingers Falls, NY)
8/846929 International Business Machines Corporation (Armonk, NY)
International Classification: B23K 3102, B23K 3522U.S. Classification: 228 563

Abstract: The present invention relates generally to a new scheme of providing a seal band for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core, and lower melting point thin interconnecting solder layers, where the thin interconnecting solder layers may have similar or different melting points.

Reworkable Polymer Chip Encapsulant

United States Patent InventorAppl. No.Assignee

#5659203Aug 19, 1997

Filed: Jun 7, 1995

Anson Jay Call (Holmes, NY)
Stephen Leslie Buchwalter (Hopewell Junction, NY)
Sushumna Iruvanti (Wappingers Falls, NY)
Stanley J. Jasne (Yorktown, NY)
Frank L. Pompeo (Walden, NY)
Paul Anthony Zucco (Red Hook, NY)
Wayne Martin Moreau (Wappingers Falls, NY)
8/477062 International Business Machines Corporation (Armonk, NY)
International Classification: H01L 2328U.S. Classification: 257778

Abstract: A C4 or flip chip reworkable electronic device is provided comprising integrated circuit chip having conductive pads thereon which pads are electrically connected to corresponding pads on an interconnection substrate by solder connections, wherein the space between the chip and substrate is sealed using a specially defined thermoplastic resin such as polysulfone and polyetherimide.

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Frank Pompeo Historical Name Popularity

Name Popularity for Frank Pompeo (Percent of Births)00.10.20.30.40.50.60.70.80.911.11.21.300.00010.00020.00030.00040.00050.00060.00070.00080.00090.0010.00110.00120.00130.001419001905191019151920192519301935194019451950195519601965197019751980198519901995First Name: FrankLast Name: Pompeo
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Frank Pompeo Most Popular States

First Name: FrankOther 36.4%CA 10.5%NY 10.0%FL 9.2%TX 6.7%PA 6.2%NJ 5.0%IL 4.3%OH 3.9%MI 2.9%MA 2.6%NC 2.4% Last Name: PompeoOther 17.9%MA 17.4%NY 11.1%NJ 11.1%FL 11.1%PA 7.5%NM 5.9%CA 5.8%OH 3.7%WA 2.9%ME 2.8%IL 2.7%
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Frank Pompeo Most Popular Professions

First Name: FrankOwnerManagerDirectorChairpersonProperty ManagerVice PresidentLicensed Real Estate BrokerInformation Technology SpecialistAccounting BookkeeperCorporate Executive02,0004,0006,0008,00010,00012,00014,000 Last Name: PompeoOwnerLicensed Real Estate BrokerProperty ManagerFinance and Accounting SpecialistAccounting BookkeeperAgentManagerAdvertising ProfessionalCounselorChairperson0369121518212427
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