Instruct: Identify the main and secondary category of Arxiv papers based on the titles and abstracts
Query: Thermocompression Bonding Technology for Multilayer Superconducting
  Quantum Circuits   Extensible quantum computing architectures require a large array of quantum
devices operating with low error rates. A quantum processor based on
superconducting quantum bits can be scaled up by stacking microchips that each
perform different computational functions. In this article, we experimentally
demonstrate a thermocompression bonding technology that utilizes indium films
as a welding agent to attach pairs of lithographically-patterned chips. We
perform chip-to-chip indium bonding in vacuum at $190^{\circ}C$ with indium
film thicknesses of $150 nm$. We characterize the dc and microwave performance
of bonded devices at room and cryogenic temperatures. At $10 mK$, we find a dc
bond resistance of $515 n{\Omega}mm^2$. Additionally, we show minimal microwave
reflections and good transmission up to $6.8 GHz$ in a tunnel-capped, bonded
device as compared to a similar uncapped device. As a proof of concept, we
fabricate and measure a set of tunnel-capped superconducting resonators,
demonstrating that our bonding technology can be used in quantum computing
applications.

1
The categories of this paper are: cs
10
The categories of this paper are: q-bio
12
The categories of this paper are: nucl-th
33
The categories of this paper are: plasm-ph
21
The categories of this paper are: adap-org
16
The categories of this paper are: stat
26
The categories of this paper are: bayes-an
9
The categories of this paper are: nlin
22
The categories of this paper are: chao-dyn
34
The categories of this paper are: chem-ph
25
The categories of this paper are: patt-sol
8
The categories of this paper are: hep-ex
2
The categories of this paper are: math
28
The categories of this paper are: alg-geom
18
The categories of this paper are: econ
37
The categories of this paper are: supr-con