Instruct: Identify the main and secondary category of Arxiv papers based on the titles and abstracts
Query: Diffusion-controlled growth of phases in metal-tin systems related to
  microelectronics packaging   The electroâmechanical connection between under bump metallization (UBM) and
solder in flipâchip bonding is achieved by the formation of brittle
intermetallic compounds (IMCs) during the soldering process. These IMCs
continue to grow in the solidâstate during storage at room temperature and
service at an elevated temperature leading to degradation of the contacts. In
this thesis, the diffusionâcontrolled growth mechanism of the phases and the
formation of the Kirkendall voids at the interface of UBM (Cu, Ni, Au, Pd, Pt)
and Sn (bulk/electroplated) are studied extensively.

27
The categories of this paper are: comp-gas
17
The categories of this paper are: q-fin
28
The categories of this paper are: alg-geom
14
The categories of this paper are: math-ph
34
The categories of this paper are: chem-ph
31
The categories of this paper are: ao-sci
5
The categories of this paper are: gr-qc
21
The categories of this paper are: adap-org
4
The categories of this paper are: cond-mat
25
The categories of this paper are: patt-sol
10
The categories of this paper are: q-bio
20
The categories of this paper are: acc-phys
26
The categories of this paper are: bayes-an
32
The categories of this paper are: atom-ph
24
The categories of this paper are: dg-ga
35
The categories of this paper are: mtrl-th