Daily Papers

Printed Circuit Board (PCB) assurance in the optical domain is a crucial field of study. Though there are many existing PCB assurance methods using image processing, computer vision (CV), and machine learning (ML), the PCB field is complex and increasingly evolving so new techniques are required to overcome the emerging problems. Existing ML-based methods outperform traditional CV methods, however they often require more data, have low explainability, and can be difficult to adapt when a new technology arises. To overcome these challenges, CV methods can be used in tandem with ML methods. In particular, human-interpretable CV algorithms such as those that extract color, shape, and texture features increase PCB assurance explainability. This allows for incorporation of prior knowledge, which effectively reduce the number of trainable ML parameters and thus, the amount of data needed to achieve high accuracy when training or retraining an ML model. Hence, this study explores the benefits and limitations of a variety of common computer vision-based features for the task of PCB component detection using semantic data. Results of this study indicate that color features demonstrate promising performance for PCB component detection. The purpose of this paper is to facilitate collaboration between the hardware assurance, computer vision, and machine learning communities.

Outsourced printed circuit board (PCB) fabrication necessitates increased hardware assurance capabilities. Several assurance techniques based on automated optical inspection (AOI) have been proposed that leverage PCB images acquired using digital cameras. We review state-of-the-art AOI techniques and observe a strong, rapid trend toward machine learning (ML) solutions. These require significant amounts of labeled ground truth data, which is lacking in the publicly available PCB data space. We contribute the FICS PCB Image Collection (FPIC) dataset to address this need. Additionally, we outline new hardware security methodologies enabled by our data set.

The usage of electronic devices increases, and becomes predominant in most aspects of life. Surface Mount Technology (SMT) is the most common industrial method for manufacturing electric devices in which electrical components are mounted directly onto the surface of a Printed Circuit Board (PCB). Although the expansion of electronic devices affects our lives in a productive way, failures or defects in the manufacturing procedure of those devices might also be counterproductive and even harmful in some cases. It is therefore desired and sometimes crucial to ensure zero-defect quality in electronic devices and their production. While traditional Image Processing (IP) techniques are not sufficient to produce a complete solution, other promising methods like Deep Learning (DL) might also be challenging for PCB inspection, mainly because such methods require big adequate datasets which are missing, not available or not updated in the rapidly growing field of PCBs. Thus, PCB inspection is conventionally performed manually by human experts. Unsupervised Learning (UL) methods may potentially be suitable for PCB inspection, having learning capabilities on the one hand, while not relying on large datasets on the other. In this paper, we introduce ChangeChip, an automated and integrated change detection system for defect detection in PCBs, from soldering defects to missing or misaligned electronic elements, based on Computer Vision (CV) and UL. We achieve good quality defect detection by applying an unsupervised change detection between images of a golden PCB (reference) and the inspected PCB under various setting. In this work, we also present CD-PCB, a synthesized labeled dataset of 20 pairs of PCB images for evaluation of defect detection algorithms.

In recent years, Printed Circuit Boards (PCB) have become the backbone of a large number of consumer electronic devices leading to a surge in their production. This has made it imperative to employ automatic inspection systems to identify manufacturing defects in PCB before they are installed in the respective systems. An important task in this regard is the classification of defects as either true or pseudo defects, which decides if the PCB is to be re-manufactured or not. This work proposes a novel approach to detect most common defects in the PCBs. The problem has been approached by employing highly discriminative features based on multi-scale wavelet transform, which are further boosted by using a kernalized version of the support vector machines (SVM). A real world printed circuit board dataset has been used for quantitative analysis. Experimental results demonstrated the efficacy of the proposed method.

Quality control is of vital importance during electronics production. As the methods of producing electronic circuits improve, there is an increasing chance of solder defects during assembling the printed circuit board (PCB). Many technologies have been incorporated for inspecting failed soldering, such as X-ray imaging, optical imaging, and thermal imaging. With some advanced algorithms, the new technologies are expected to control the production quality based on the digital images. However, current algorithms sometimes are not accurate enough to meet the quality control. Specialists are needed to do a follow-up checking. For automated X-ray inspection, joint of interest on the X-ray image is located by region of interest (ROI) and inspected by some algorithms. Some incorrect ROIs deteriorate the inspection algorithm. The high dimension of X-ray images and the varying sizes of image dimensions also challenge the inspection algorithms. On the other hand, recent advances on deep learning shed light on image-based tasks and are competitive to human levels. In this paper, deep learning is incorporated in X-ray imaging based quality control during PCB quality inspection. Two artificial intelligence (AI) based models are proposed and compared for joint defect detection. The noised ROI problem and the varying sizes of imaging dimension problem are addressed. The efficacy of the proposed methods are verified through experimenting on a real-world 3D X-ray dataset. By incorporating the proposed methods, specialist inspection workload is largely saved.

Printed Circuit Boards are the foundation for the functioning of any electronic device, and therefore are an essential component for various industries such as automobile, communication, computation, etc. However, one of the challenges faced by the PCB manufacturers in the process of manufacturing of the PCBs is the faulty placement of its components including missing components. In the present scenario the infrastructure required to ensure adequate quality of the PCB requires a lot of time and effort. The authors present a novel solution for detecting missing components and classifying them in a resourceful manner. The presented algorithm focuses on pixel theory and object detection, which has been used in combination to optimize the results from the given dataset.

There can be numerous electronic components on a given PCB, making the task of visual inspection to detect defects very time-consuming and prone to error, especially at scale. There has thus been significant interest in automatic PCB component detection, particularly leveraging deep learning. However, deep neural networks typically require high computational resources, possibly limiting their feasibility in real-world use cases in manufacturing, which often involve high-volume and high-throughput detection with constrained edge computing resource availability. As a result of an exploration of efficient deep neural network architectures for this use case, we introduce PCBDet, an attention condenser network design that provides state-of-the-art inference throughput while achieving superior PCB component detection performance compared to other state-of-the-art efficient architecture designs. Experimental results show that PCBDet can achieve up to 2times inference speed-up on an ARM Cortex A72 processor when compared to an EfficientNet-based design while achieving sim2-4\% higher mAP on the FICS-PCB benchmark dataset.

Automated detection of defects in Printed Circuit Board (PCB) manufacturing using Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) machines can help improve operational efficiency and significantly reduce the need for manual intervention. In this paper, using SPI-extracted features of 6 million pins, we demonstrate a data-centric approach to train Machine Learning (ML) models to detect PCB defects at three stages of PCB manufacturing. The 6 million PCB pins correspond to 2 million components that belong to 15,387 PCBs. Using a base extreme gradient boosting (XGBoost) ML model, we iterate on the data pre-processing step to improve detection performance. Combining pin-level SPI features using component and PCB IDs, we developed training instances also at the component and PCB level. This allows the ML model to capture any inter-pin, inter-component, or spatial effects that may not be apparent at the pin level. Models are trained at the pin, component, and PCB levels, and the detection results from the different models are combined to identify defective components.

To coupe with the difficulties in the process of inspection and classification of defects in Printed Circuit Board (PCB), other researchers have proposed many methods. However, few of them published their dataset before, which hindered the introduction and comparison of new methods. In this paper, we published a synthesized PCB dataset containing 1386 images with 6 kinds of defects for the use of detection, classification and registration tasks. Besides, we proposed a reference based method to inspect and trained an end-to-end convolutional neural network to classify the defects. Unlike conventional approaches that require pixel-by-pixel processing, our method firstly locate the defects and then classify them by neural networks, which shows superior performance on our dataset.

The emergence of new nanoscale technologies has imposed significant challenges to designing reliable electronic systems in radiation environments. A few types of radiation like Total Ionizing Dose (TID) effects often cause permanent damages on such nanoscale electronic devices, and current state-of-the-art technologies to tackle TID make use of expensive radiation-hardened devices. This paper focuses on a novel and different approach: using machine learning algorithms on consumer electronic level Field Programmable Gate Arrays (FPGAs) to tackle TID effects and monitor them to replace before they stop working. This condition has a research challenge to anticipate when the board results in a total failure due to TID effects. We observed internal measurements of the FPGA boards under gamma radiation and used three different anomaly detection machine learning (ML) algorithms to detect anomalies in the sensor measurements in a gamma-radiated environment. The statistical results show a highly significant relationship between the gamma radiation exposure levels and the board measurements. Moreover, our anomaly detection results have shown that a One-Class Support Vector Machine with Radial Basis Function Kernel has an average Recall score of 0.95. Also, all anomalies can be detected before the boards stop working.

In this paper, we introduce an approach for detecting modifications in assembled printed circuit boards based on photographs taken without tight control over perspective and illumination conditions. One instance of this problem is the visual inspection of gas pumps PCBs, which can be modified by fraudsters wishing to deceive costumers or evade taxes. Given the uncontrolled environment and the huge number of possible modifications, we address the problem as a case of anomaly detection, proposing an approach that is directed towards the characteristics of that scenario, while being well-suited for other similar applications. The proposed approach employs a deep convolutional autoencoder trained to reconstruct images of an unmodified board, but which remains unable to do the same for images showing modifications. By comparing the input image with its reconstruction, it is possible to segment anomalies and modifications in a pixel-wise manner. Experiments performed on a dataset built to represent real-world situations (and which we will make publicly available) show that our approach outperforms other state-of-the-art approaches for anomaly segmentation in the considered scenario, while producing comparable results on the popular MVTec-AD dataset for a more general object anomaly detection task.

Addressing the critical theme of recycling electronic waste (E-waste), this contribution is dedicated to developing advanced automated data processing pipelines as a basis for decision-making and process control. Aligning with the broader goals of the circular economy and the United Nations (UN) Sustainable Development Goals (SDG), our work leverages non-invasive analysis methods utilizing RGB and hyperspectral imaging data to provide both quantitative and qualitative insights into the E-waste stream composition for optimizing recycling efficiency. In this paper, we introduce 'PCB-Vision'; a pioneering RGB-hyperspectral printed circuit board (PCB) benchmark dataset, comprising 53 RGB images of high spatial resolution paired with their corresponding high spectral resolution hyperspectral data cubes in the visible and near-infrared (VNIR) range. Grounded in open science principles, our dataset provides a comprehensive resource for researchers through high-quality ground truths, focusing on three primary PCB components: integrated circuits (IC), capacitors, and connectors. We provide extensive statistical investigations on the proposed dataset together with the performance of several state-of-the-art (SOTA) models, including U-Net, Attention U-Net, Residual U-Net, LinkNet, and DeepLabv3+. By openly sharing this multi-scene benchmark dataset along with the baseline codes, we hope to foster transparent, traceable, and comparable developments of advanced data processing across various scientific communities, including, but not limited to, computer vision and remote sensing. Emphasizing our commitment to supporting a collaborative and inclusive scientific community, all materials, including code, data, ground truth, and masks, will be accessible at https://github.com/hifexplo/PCBVision.